Assembly to meet requirements of specification 01417-sc-x15451 and to be manufactured in accordance with process specification 11655194; highest component not to exceed .62 from board surface; major components: board printed circuit 4; capacitor no. 2 1; capacitor no. 3 1; connector 4; semiconductor device diode no. 5 1; semiconductor device diode no. 6 23; semiconductor device transistor 1; semiconductor device zener 2; microcircuit precision timer 1; pad no. 10 1; pad no. 11 1; relay no. 12 3; relay no. 13 2; resistor nos 14, 15, 16, 17 1 ea; rivet 2; spacer no. 19 3; spacer no. 20 2
NSN 4140-01-215-6672
NSN 6220-01-162-7954
NSN 6685-01-546-0804
NSN 5985-01-048-4025
NSN 7035-01-323-0164
NSN 5996-01-495-9197
NSN 6110-00-110-1983
NSN 5985-01-476-8978
NSN 5996-01-648-4989
NSN 6645-00-431-9472
NSN 5910-01-441-8640
NSN 5996-00-246-8295
Last Updated: 01/11/2025